TY - JOUR
AU - Du, Zhehua
AB - Heat flux of electronic equipment shows an increasing trend with the increasing demand for miniaturization and high performance. Low heat dissipation capacity makes it difficult to apply air cooling technology to high heat flux electronic devices in the future. At present, liquid cooling technology is the research hotspot of cooling solutions for electronics, mainly because liquid cooling has the advantages of strong fluidity and high heat transfer coefficient. Several kinds of liquid cooling technologies which can be used for cooling electronic equipment are introduced in this paper, among which micro-channel cooling, spray cooling, jet cooling and immersion cooling are emphasized. The working principle and progress in research of each liquid cooling technology are introduced and analyzed. Finally, the future development direction of liquid-based cooling technology is discussed. The problems in the research direction of liquid cooling technology are pointed out. Some suggestions for further research on liquid cooling technology are put forward.
TI - Research progress of liquid cooling technology for high heat flux electronic equipment
JF - Proceedings of SPIE
DO - 10.1117/12.2685556
DA - 2023-08-15
UR - https://www.deepdyve.com/lp/spie/research-progress-of-liquid-cooling-technology-for-high-heat-flux-IIum2K40AE
SP - 1271908
EP - 1271908-5
VL - 12719
IS - 
DP - DeepDyve
ER -