TY - JOUR
AU - Mollenkopf, Christine T.
AB - Photonic smart pixel arrays are being developed for use in high density input/output applications. Arrays containing 1024 smart pixels are integrated on a single chip which occupies 1.6 cm X 1.6 cm of area. A smart pixel cell is made up of a vertical cavity surface emitting laser (VCSEL), a detector, an analog receiver, a laser driver, and digital logic circuitry. Additional circuitry can be embedded in the smart pixel cell to provide increased functionality, such as digital logic operations and memory functions. A diffractive optical interconnect element can be added to the smart pixel array for optimization of a free space optical interconnect system. The oxide-confined GaAs/AlGaAs VCSELs and the GaAs/AlGaAs detectors will be flip-chip bonded to the surface of the CMOS substrate. The surface of the CMOS substrate will be processed after circuit fabrication in preparation for flip-chip bonding. This processing will make the pads of the CMOS compatible with the contacts of the VCSEL and detector surfaces. The integrated smart pixel combines low power consumption and high speed operation in an optoelectronic module for the use in high speed optical interconnects.
TI - CMOS-compatible free-space optical interconnects
JF - Proceedings of SPIE
DO - 10.1117/12.308877
DA - 1998-05-22
UR - https://www.deepdyve.com/lp/spie/cmos-compatible-free-space-optical-interconnects-GoFNVWQ04j
SP - 560
EP - 563
VL - 3490
IS - 1
DP - DeepDyve
ER -