TY - JOUR
AU1 - Chang, Li-Ting
AU2 - Liu, Yu-Lin
AU3 - Huang, Chi-hao
AU4 - Kushwaha, Rishabh
AU5 - Chuan Sun, Yen Chun
AU6 - Wu, Cheng Hung
AU7 - Cheng, Shao Chang
AU8 - Su, Hsiao Fei
AU9 - Liu, Yen Hung
AU1 - Yang, Mars
AU1 - Yang, Elvis
AU1 - Yang, T. H.
AU1 - Chen, K. C.
AB - As device dimensions continuously shrink in semiconductor manufacturing, even tighter overlay control is indispensable to secure good device yield. Using traditional optical overlay metrology via scribe-lane marks it is challenging to achieve good intra-field high-order process correction (iHOPC) due to the limited mark count and uneven mark distribution. Also the scribe-lane based metrology may not fully represent the in-device behavior in some cases. In order to achieve improved accuracy and precision of in-device overlay control, new metrology methodology solution is required. In this paper, three complementary overlay metrology techniques – high voltage scanning electron microscope (HV-SEM), optical scatterometry critical dimension measurement (SCD), and traditional scribe-lane based optical overlay metrology – were adopted for in-device overlay improvement. In 3D NAND device production, in-device overlay measurement is getting more challenging due to the thicker or complex film stack. Though both HV-SEM and SCD are able to measure in-device patterns via capturing buried structures, their different tool principles make them suitable in different situations. Through applying non-zero offset (NZO) overlay compensation at photo exposure, the in-device overlay performance can be enhanced by iHOPC, which is enabled by incorporating high-density in-device sampling measurements from HV-SEM and SCD into traditional optical scribe-lane optical overlay measurements. The improved overlay performance was demonstrated for different process layers in this study.
TI - In device overlay control with multiple overlay metrology in 3D-NAND process
JF - Proceedings of SPIE
DO - 10.1117/12.2613193
DA - 2022-05-26
UR - https://www.deepdyve.com/lp/spie/in-device-overlay-control-with-multiple-overlay-metrology-in-3d-nand-CWDrdFwi70
SP - 120531P
EP - 120531P-9
VL - 12053
IS - 
DP - DeepDyve
ER -