TY - JOUR
AU - Li, Hailong
AB - The effect of 7K extreme low temperature storage on the electrical and mechanical properties of Sn–3.0%Ag–0.5%Cu(SAC305)/SnPb/electroless nickel immersion gold (ENIG) pads mixed solder joints was investigated. The resistance of the daisy chained solder joints was measured after RT and 7K storage, respectively. Ball shear test was conducted, and the morphography of the fracture surfaces was analyzed. Microstructure observations revealed that the composition of the intermetallic compound (IMC) layer next to the printed circuit boards (PCB) pads remained a combination of (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4 after 7K storage. A very small amount of residual Pb rich phase owing to the degolding and plating process, even 1 wt%, could inhibit the evolution of IMCs as well as tin pest. This study could provide theoretical support for the application of SAC305/SnPb mixed solder joints under extreme low temperature, such as thermally uncontrolled electronics for deep space exploration.
TI - Research on the effect of 7K extreme low temperature storage on the electrical and mechanical properties of SAC305/SnPb mixed solder joints
JF - Journal of Materials Science: Materials in Electronics
DO - 10.1007/s10854-025-14301-4
DA - 2025-02-01
UR - https://www.deepdyve.com/lp/springer-journals/research-on-the-effect-of-7k-extreme-low-temperature-storage-on-the-COdP8VKJIC
VL - 36
IS - 4
DP - DeepDyve
ER -