TY - JOUR
AB - The present disclosure is related to bimodal A thermoplastic modacrylic resin compo- high-density polyethylene polymer compo- sition includes a modacrylic resin and a sitions with increased high melt strength and plasticizer. The modacrylic resin includes good processability comprising a base resin 15 to 85 wt % of acrylonitrile, 15 to 85 wt which has a density of about 945 kg/ m to 3 % of vinyl chloride and/or vinylidene about 955 kg/ m , and comprises an ethylene chloride, and 0 to 20 wt % of another vinyl polymer (A) having a density of at least 3 monomer, and the plasticizer is an organic about 968 kg/m , in an amount ranging from compound that is compatible with the 45% to 55% by weight and an ethylene modacrylic resin and has a boiling point of polymer (B) having a density lower than the at least 200 C. A method for manufactur- density of polymer (A) wherein said com- ing a thermoplastic modacrylic resin position has a complex viscosity at a shear composition includes melt-kneading a rate of 0.01 rad/s ranging from about 200 to powder mixture obtained by mixing a about 450 kPas and a complex viscosity at a 
TI - Patents
JF - Journal of Elastomers and Plastics
DO - 10.1177/0095244320988367
DA - 2021-04-01
UR - https://www.deepdyve.com/lp/sage/patents-CCUFF0Sw0b
SP - 270
EP - 280
VL - 53
IS - 3
DP - DeepDyve
ER -