TY - JOUR
AU - Mai, Carsten
AB - The study objective was to impart urea-formaldehyde (UF) bonded particleboards higher and longer-lasting
  hydrophobicity than that resulting from conventionally used paraffin. Alkyl ketene dimer (AKD) is a paper
  sizing agent that can theoretically esterify wood compounds and result in a surface modification. Particles
  were 1) impregnated with an aqueous AKD-solution and cured at 130 °C prior to gluing, or 2) sprayed
  with a mixture of AKD-solution and UF-resin in a single step. Boards with and without paraffin
  wax were used as controls. Thickness swelling after 2, 24, and 48 h immersion was decreased by 90,
  62, and 59% when the chips were impregnated with AKD in comparison to untreated control boards. Water
  uptake after 2, 24, and 48 h was reduced by 91, 75, and 60%. AKD-impregnation with subsequent curing
  decreased the internal bond strength by 53%, indicating that AKD impedes the adhesion. The mixture of
  AKD and UF-glue did not result in considerable hydrophobicity. Increased methyl/methylene and carbonyl
  bands in FTIR-spectra after toluene-extraction suggest that AKD partially formed ester bonds at the wood
  surface.
 
TI - Use of alkyl ketene dimer (AKD) for surface modification of particleboard chips
JF - European Journal of Wood and Wood Products
DO - 10.1007/s00107-008-0275-z
DA - 2008-08-28
UR - https://www.deepdyve.com/lp/springer-journals/use-of-alkyl-ketene-dimer-akd-for-surface-modification-of-8XKXVJ52sE
SP - 37
EP - 45
VL - 67
IS - 1
DP - DeepDyve
ER -