TY - JOUR
AU - Binns, L. A.
AB - Improved overlay capability and sampling to control advanced lithography has accelerated the need for compact, multilayer/ mask/field/mark overlay metrology. The Blossom approach minimizes the size of the overlay marks associated with each layer while maximizing the density of marks within the overlay metrology tool's field of view (FOV). Here we describe our progress implementing this approach in 45nm manufacturing.
TI - Blossom overlay metrology implementation
JF - Proceedings of SPIE
DO - 10.1117/12.712669
DA - 2007-03-16
UR - https://www.deepdyve.com/lp/spie/blossom-overlay-metrology-implementation-7rbzyppOuu
SP - 65180G
EP - 65180G-6
VL - 6518
IS - 1
DP - DeepDyve
ER -