TY - JOUR
AU - Tan, Guangbin
AB - The aim of this article is to provide a systematic numerical experimental method to evaluate the thermomechanical reliability of plastic ball grid array (PBGA) under thermal cycling based on the Taguchi method. An L18(21 × 37) orthogonal array is designed for selecting eight control factors of BGA, which includes Printed Circuit Board) dimensions, substrate dimensions, dimensions of solder joints, the thickness of silicon die and the thickness of encapsulation molding compound. The Taguchi method evaluation shows that the best matching combination of geometry parameters for improving the reliability of solder under thermal cycling. It builds a basis for future work for design and reliability evaluation of PBGA packaging. Copyright © 2010 John Wiley & Sons, Ltd.
TI - Taguchi‐numerical approach on thermomechanical reliability for PBGA
JF - International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
DO - 10.1002/jnm.789
DA - 2011-09-01
UR - https://www.deepdyve.com/lp/wiley/taguchi-numerical-approach-on-thermomechanical-reliability-for-pbga-1HqZAXpN49
SP - 437
EP - 447
VL - 24
IS - 5
DP - DeepDyve
ER -