TY - JOUR
AU1 - Takagi, M.
AU2 - Yamaji, T.
AB - Today, approximately three years since its development, the noncontact micro soldering method local soldering method continues to be highly regarded due to its superiority over other soldering methods i.e., soldering irons, etc. and is being used in a wide range of applications in the industrial electronics field. This technology has been incorporated into the production lines of numerous plants worldwide including the USA and Japan. This paper focuses on introducing the following 1 the micro spot soldering method, the method most frequently utilised in production lines 2 the continuous soldering method newly developed for use with surfacemount components such as connectors of PCMCIA memory cards and 3 the upward soldering method in which the light beam is irradiated upward, enabling the components to be soldered without flipping printed circuit boards PCBs. The paper will also include practical examples, the optimal circuit board design, and an evaluation of soldering quality.
TI - New Soldering Process Using Light Beam Technology
JF - Soldering & Surface Mount Technology
DO - 10.1108/eb037893
DA - 1995-02-01
UR - https://www.deepdyve.com/lp/emerald-publishing/new-soldering-process-using-light-beam-technology-0riy0yTeag
SP - 13
EP - 18
VL - 7
IS - 2
DP - DeepDyve
ER -