TY - JOUR
AU - Goloshevsky, N. V.
AB - Abstract To miniaturize the component base, it is necessary to develop new procedures for material processing and the laser technique is one such procedure. Structure geometry formed during laser microprocessing can be changed significantly from the geometry predetermined in the CAD model since the instrumentation settings can be not optimal. To automate the process of choosing parameters for laser microprocessing, a procedure for analyzing images that makes it possible to localize the microstructures for materials with different physical-chemical and optical properties and to obtain the information on its geometrical parameters has been developed.
TI - Method for localizing and measuring structures formed under laser microprocessing
JF - Pattern Recognition and Image Analysis
DO - 10.1134/s1054661811020143
DA - 2011-09-01
UR - https://www.deepdyve.com/lp/springer-journals/method-for-localizing-and-measuring-structures-formed-under-laser-0P709CDqrd
SP - 373
EP - 376
VL - 21
IS - 3
DP - DeepDyve
ER -