%0 Journal Article
%T Chemical Mechanical Polishing and Planarization of Mn-Based Barrier/Ru Liner Films in Cu Interconnects for Advanced Metallization Nodes
%A Sagi, K. V.
%A Teugels, L. G.
%A van der Veen, M. H.
%A Struyf, Herbert
%A Babu, S. V.
%J ECS Journal of Solid State Science and Technology
%V 6
%N 5
%@ 2162-8769
%D 2017-01-01
%~ DeepDyve