%0 Journal Article
%T Realistic warpage evaluation of printed board assembly during reflow process
%A Chung, Soonwan 
%A Kwak, Jae B.
%J Soldering & Surface Mount Technology
%V 27
%N 4
%P 137-145
%@ 0954-0911
%D 2015-09-07
%I Emerald Group Publishing Limited
%~ DeepDyve