%0 Journal Article
%T A wafer-level multi-chip module process with thick photosensitive benzocyclobutene as the dielectric for microwave application
%A Tang, Jiajie
%A Sun, Xiaowei
%A Luo, Le
%J Journal of Micromechanics and Microengineering
%V 21
%N 6
%P 8
%@ 0960-1317
%D 2011-06-01
%~ DeepDyve