%0 Journal Article
%T Mode I Fatigue and Fracture Assessment of Polyimide–Epoxy and Silicon–Epoxy Interfaces in Chip-Package Components
%A Morais, Pedro
%A Akhavan-Safar, Alireza
%A Carbas, Ricardo J. C.
%A Marques, Eduardo A. S.
%A Karunamurthy, Bala
%A da Silva, Lucas F. M.
%J Polymers
%V 16
%N 4
%@ 2073-4360
%D 2024-02-07
%I Multidisciplinary Digital Publishing Institute
%~ DeepDyve