%0 Journal Article
%T Wafer level warpage characterization of 3D interconnect processing wafers
%A Chang, Po-Yi
%A Ku, Yi-Sha
%J Proceedings of SPIE
%V 8324
%N 1
%P 832415-832415-6
%@ 0277-786X
%D 2012-02-13
%I SPIE
%~ DeepDyve