%0 Journal Article
%T Towards zero defects: machine learning-driven solder bump reliability in semiconductor packaging
%A Kottur, Himanandhan Reddy
%A Biswas, Liton Kumar
%A Varshney, Nitin
%A Ghosh, Shajib
%A Asadizanjani, Navid
%J Proceedings of SPIE
%V 13426
%P 134264D-134264D-6
%@ 0277-786X
%D 2025-04-23
%I SPIE
%~ DeepDyve