%0 Journal Article
%T Simulation of the transient temperature distribution in a high‐power semiconductor device cooling apparatus using heat pipes
%A Suzuki, Osamu
%A Fujioka, Kazumasa
%A Kuwahara, Heikichi
%A Takasaki, Toshio
%J Heat Transfer-Asian Research
%V 26
%N 2
%P 107-115
%@ 1099-2871
%D 1997-01-01
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve