%0 Journal Article
%T Shear test evaluation of the mechanical reliability of micro bumps in semiconductors
%A Cho, Yeungjung
%A Hahn, Mibbeum
%A Jeong, Hyunsik
%A Jang, Gunhee
%J Microsystem Technologies
%V 28
%N 10
%P 2173-2180
%@ 0946-7076
%D 2022-10-01
%I Springer Berlin Heidelberg
%~ DeepDyve