%0 Journal Article
%T Finite Element Analysis for Reliability of Solder Joints Materials in the Embedded Package
%A Cho, Seunghyun
%A Ko, Youngbae
%J Electronic Materials Letters
%V 15
%N 3
%P 287-296
%@ 1738-8090
%D 2019-05-01
%I The Korean Institute of Metals and Materials
%~ DeepDyve