%0 Journal Article
%T Optimization of TSV Leakage in Via-Middle TSV Process for Wafer-Level Packaging
%A Liu, Xuanjie
%A Sun, Qingqing
%A Huang, Yiping
%A Chen, Zheng
%A Liu, Guoan
%A Zhang, David Wei
%J Electronics
%V 10
%N 19
%@ 2079-9292
%D 2021-09-29
%I Multidisciplinary Digital Publishing Institute
%~ DeepDyve