%0 Journal Article
%T Coefficient of thermal expansion and thermal conductivity of poly(ether-ketone)–silica nanocomposites for electronic packaging substrate
%A Joshi, Mandar
%A Gadve, Roshan
%A Upadhyay, Gautam
%A Goyal, R. K.
%J Journal of Materials Science Materials in Electronics
%V 34
%N 36
%@ 0957-4522
%D 2023-12-01
%I Springer US
%~ DeepDyve