%0 Journal Article
%T Temporary Wafer Bonding and Debonding for 3D Integration Using an Electrochemically Active Polymer Adhesive
%A Gatty, Hithesh K.
%A Schröder, Stephan
%A Niklaus, Frank
%A Roxhed, Niclas
%A Stemme, Göran
%J ECS Journal of Solid State Science and Technology
%V 3
%N 5
%@ 2162-8769
%D 2014-01-01
%~ DeepDyve