%0 Journal Article
%T Study on the interfacial reactions for Ag/Sn/Cu TLP during transient liquid phase soldering process
%A Diao, He
%A Liu, Jiahao
%A Zhong, Xiangxiang
%A Wang, Fengyi
%A Qiu, Lijin
%A Chen, Yini
%A Chen, Hongtao
%A Guo, Xiaotong
%A Li, Mingyu
%J Journal of Materials Science: Materials in Electronics
%V 36
%N 5
%@ 0957-4522
%D 2025-02-01
%I Springer US
%~ DeepDyve