%0 Journal Article
%T A New Post-Treatment for Chemical-Mechanical Polishing Process  of Very Large-Scale Integrated Circuit Tungsten Vias
%A Park, Heungsoo
%A Cho, Yong-Jun
%A Song, Jae-In
%A Koh, Young-Bum
%A Lee, Moon-Yong
%J Japanese Journal of Applied Physics
%V 37
%N 7R
%@ 0021-4922
%D 1998-07-01
%~ DeepDyve