%0 Journal Article
%T Study on deformation conditions of epoxy compounds for semiconductor integrated circuits
%A Saiki, H. 
%A Nishitake, H.
%A Marumo, Y.
%A Sakamoto, H.
%A Hazama, M.
%A Sakata, F.
%J International Journal of Microstructure and Materials Properties
%V 2
%N 2
%P 214-223
%@ 1741-8410
%D 2007-01-01
%I Inderscience Publishers
%~ DeepDyve