%0 Journal Article
%T Residual Stress and Warping Analysis of the Nano-Silver Pressureless Sintering Process in SiC Power Device Packaging
%A Tian, Wenchao
%A Li, Dexin
%A Dang, Haojie
%A Liang, Shiqian
%A Zhang, Yizheng
%A Zhang, Xiaojun
%A Chen, Si
%A Yu, Xiaochuan
%J Micromachines
%V 15
%N 9
%@ 2072-666X
%D 2024-08-28
%I Multidisciplinary Digital Publishing Institute
%~ DeepDyve