%0 Journal Article
%T Optimal design of wafer back-grinding feeding profile considering subsurface damage and productivity
%A Kim, Byeong-Geon
%A Hwang, ByungHyun
%A Park, Kyoung-Su
%J Microsystem Technologies
%V 30
%N 6
%P 769-782
%@ 0946-7076
%D 2024-06-01
%I Springer Berlin Heidelberg
%~ DeepDyve