%0 Journal Article
%T Glass‐to‐Glass Bonding for Vacuum Packaging of Field Emission Display in an Ultra‐High‐Vacuum Chamber Using Silicon Thin Film
%A Choi, W. B.
%A Ju, B. K.
%A Lee, Y. H.
%A Jeong, S. J.
%A Lee, N. Y.
%A Sung, M. Y.
%A Oh, M. H.
%J Journal of the Electrochemical Society
%V 146
%N 1
%P 400-404
%@ 0013-4651
%D 1999-01-01
%~ DeepDyve