%0 Journal Article
%T Circuit modeling and performance analysis of SWCNT bundle 3D interconnects
%A Qian, Libo
%A Zhu, Zhangming
%A Ding, Ruixue
%A Yang, Yintang
%J Journal of Semiconductors
%V 34
%N 9
%P 7
%@ 1674-4926
%D 2013-09-01
%~ DeepDyve