%0 Journal Article
%T Detection and Characterization of CMP Pad Debris in Polishing Slurries Using Total Holographic Characterization
%A Cheong, Fook Chiong
%A Lumer, Juliana
%A Markus, Tiffany
%A Fischer, Gavrielle
%A Wu, Yongneng
%A Huang, Nai-Chieh
%A Gage, Max
%A Tang, Jianshe
%A Philips, Laura A.
%J ECS Journal of Solid State Science and Technology
%V 14
%N 2
%P 6
%@ 2162-8769
%D 2025-02-01
%I IOP Publishing
%~ DeepDyve