%0 Journal Article
%T On‐wafer thermomechanical characterization of a thin film polyimide formed by vapor deposition polymerization for through‐silicon via applications: Comparison to plasma‐enhanced chemical vapor deposition SiO2
%A Fukushima, Takafumi
%A Murugesan, Mariappan
%A Bea, Ji‐Cheol
%A Hashimoto, Hiroyuki
%A Kino, Hisashi
%A Tanaka, Tetsu
%A Koyanagi, Mitsumasa
%J Journal of Polymer Science
%V 58
%N 16
%P 2248-2258
%@ 2642-4150
%D 2020-08-15
%I Wiley Subscription Services, Inc., A Wiley Company
%~ DeepDyve