%0 Journal Article
%T Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review
%A Gan, Chong Leong
%A Chung, Min-Hua
%A Lin, Lu-Fu
%A Huang, Chen-Yu
%A Takiar, Hem
%J Journal of Materials Science Materials in Electronics
%V 34
%N 30
%@ 0957-4522
%D 2023-10-01
%I Springer US
%~ DeepDyve