%0 Journal Article
%T Low Temperature Cofired Tape Dielectric Materials System for Multilayer Interconnections
%A Steinberg, J.I.
%A Horowitz, S.J.
%A Bacher, R.J.
%J Microelectronics International
%V 3
%N 1
%P 36-39
%@ 1356-5362
%D 1986-01-01
%I Emerald Group Publishing Limited
%~ DeepDyve