%0 Journal Article
%T Injection Molding Simulation of 3D Stacked-Chip Assembly Packaging with Different Entrances
%A Lin, C.-M.
%A Lin, T.-C.
%A Chu, H.-M.
%A Chen, Y.-L.
%J Journal of Mechanics
%V 23
%N 1
%P 31-39
%D 2007-03-01
%I Oxford University Press
%~ DeepDyve