%0 Journal Article
%T Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review
%A Wang, Yongkun
%A Liu, Haozheng
%A Huo, Linghua
%A Li, Haobin
%A Tian, Wenchao
%A Ji, Haoyue
%A Chen, Si
%J Micromachines
%V 15
%N 4
%@ 2072-666X
%D 2024-03-22
%I Multidisciplinary Digital Publishing Institute
%~ DeepDyve