%0 Journal Article
%T Surface activated bonding of LCP/Cu for electronic packaging
%A Howlader, M.
%A Suga, T.
%A Takahashi, A.
%A Saijo, K.
%A Ozawa, S.
%A Nanbu, K.
%J Journal of Materials Science
%V 40
%N 12
%P 3177-3184
%@ 0022-2461
%D 2005-01-01
%I Kluwer Academic Publishers
%~ DeepDyve