%0 Journal Article
%T Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages
%A Kandasamy, Ravi
%A Subramanyam, Suresh
%J International Journal of Numerical Methods for Heat and Fluid Flow
%V 15
%N 1
%P 61-72
%@ 0961-5539
%D 2005-01-01
%I Emerald Group Publishing Limited
%~ DeepDyve