%0 Journal Article %T Effects of thermal history on the intermetallic growth and mechanical strength of Pb‐free and Sn‐Pb BGA solder balls %A Liang, J. %A Dariavach, N. %A Callahan, P. %A Shangguan, D. %J Soldering & Surface Mount Technology %V 19 %N 1 %P 4-14 %@ 0954-0911 %D 2007-02-13 %I Emerald Group Publishing Limited %~ DeepDyve