%0 Journal Article
%T Effects of thermal history on the intermetallic growth and mechanical strength of Pb‐free and Sn‐Pb BGA solder balls
%A Liang, J.
%A Dariavach, N.
%A Callahan, P.
%A Shangguan, D.
%J Soldering & Surface Mount Technology
%V 19
%N 1
%P 4-14
%@ 0954-0911
%D 2007-02-13
%I Emerald Group Publishing Limited
%~ DeepDyve