%0 Journal Article
%T Cooling of electronic components on the LTCC module with an embedded flat heat pipe
%A Nesterov, D A
%A Derevyanko, V A
%A Suntsov, S B
%J IOP Conference Series: Materials Science and Engineering
%V 1139
%N 1
%P 11
%@ 1757-8981
%D 2021-05-27
%~ DeepDyve