%0 Journal Article
%T Test chip and substrate design for flip chip microelectronic package thermal measurements
%A Joo Goh, Teck
%A Chiu, ChiaPin
%A Seetharamu, K.N.
%A Quadir, G.A.
%A Zainal, Z.A.
%J Microelectronics International
%V 23
%N 2
%P 3-10
%@ 1356-5362
%D 2006-05-01
%I Emerald Group Publishing Limited
%~ DeepDyve