%0 Journal Article
%T Materials issues in the multichip module packaging of electronics
%A Knorr, D. B.
%A Frear, D. R.
%A Winterbottom, W. L.
%J JOM
%V 44
%N 7
%P 7-7
%@ 1047-4838
%D 1992-07-01
%I Springer-Verlag
%~ DeepDyve