%0 Journal Article
%T Metallization of Vias in Silicon Wafers to Produce Three-Dimensional Microstructures
%A Vorobjova, A. I.
%A Labunov, V. A.
%A Outkina, E. A.
%A Grapov, D. V.
%J Russian Microelectronics
%V 50
%N 1
%P 8-18
%@ 1063-7397
%D 2021-02-19
%I Pleiades Publishing
%~ DeepDyve