%0 Journal Article
%T High strain rate testing of solder interconnections
%A Tsai, K.T.
%A Liu, F‐L.
%A Wong, E.H.
%A Rajoo, R.
%J Soldering & Surface Mount Technology
%V 18
%N 2
%P 12-17
%@ 0954-0911
%D 2006-04-01
%I Emerald Group Publishing Limited
%~ DeepDyve