%0 Journal Article
%T The Plastic Composite Package Provides an Economic Alternative To LSIVLSI Packaging for High Density Microcircuits
%A Mallem, O.
%A Lantaires, J.
%J Microelectronics International
%V 2
%N 4
%P 5-12
%@ 1356-5362
%D 1985-04-01
%I Emerald Group Publishing Limited
%~ DeepDyve