%0 Journal Article
%T A Process for Multilevel Copperpolyimide High Density Interconnect Structures, Flex Circuits and TAB Tape
%A Volfson, D.
%A Senturia, S.D.
%J Circuit World
%V 16
%N 3
%P 32-34
%@ 0305-6120
%D 1990-02-01
%I Emerald Group Publishing Limited
%~ DeepDyve