%0 Journal Article
%T Design and Reliability Assessment of Novel 3D-IC Packaging
%A Su, Y.-F.
%A Chiang, K.-N.
%A Liang, Steven Y.
%J Journal of Mechanics
%V 33
%N 2
%P 193-203
%D 2017-04-01
%I Oxford University Press
%~ DeepDyve