%0 Journal Article
%T Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test
%A Nie, Lei
%A Mueller, Maik
%A Osterman, Michael
%A Pecht, Michael
%J Journal of Electronic Materials
%V 39
%N 8
%P 1218-1232
%@ 0361-5235
%D 2010-05-14
%I Springer US
%~ DeepDyve