%0 Journal Article
%T New options for chip-to-chip photonic packaging by using thin glass-based waveguide substrates on board and module level
%A Schröder, H.
%A Arndt-Staufenbiel, N.
%J Proceedings of SPIE
%V 7607
%N 1
%P 76070F-76070F-10
%@ 0277-786X
%D 2010-02-03
%I SPIE
%~ DeepDyve