%0 Journal Article
%T Temperature Modeling of Reflow Soldering Based on the Heat Transfer Mechanisms
%A Tang, Zihao
%A Huang, Binshan
%J Journal of Physics: Conference Series
%V 2005
%N 1
%P 10
%@ 1742-6588
%D 2021-08-01
%I IOP Publishing
%~ DeepDyve