%0 Journal Article
%T Effect of bonding temperature on hermetic seal and mechanical support of wafer-level Cu-to-Cu thermo-compression bonding for 3D integration
%A Fan, J.
%A Lim, D.
%A Peng, L.
%A Li, K.
%A Tan, C.
%J Microsystem Technologies
%V 19
%N 5
%P 661-667
%@ 0946-7076
%D 2012-10-30
%I Springer-Verlag
%~ DeepDyve